Question:  I need a thermally conductive adhesive to put under a QFP.  I 
know that if I put it on prior to placement, it would screw up my alignment, 
soldering, etc, I plan to add a hole (.100 to .125 dia) in the PCB under the 
center of the part and apply the stuff after all assy is complete.

The adhesive properties are not important, in fact less is better. The stuff 
should be viscous enough to fill the area under the part, but not run.  It 
should be able to room temp cure in a reasonable time (2 hours or less) and 
not bloom out onto the plastic body of the part.

Does anyone out there know of such a thing?

Thanks, in advance

Jim Ennis
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