TECHNET Archives

1996

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Gen: Moisture - outgassing of pcb's
From:
"Bruenning, Jason" <[log in to unmask]>
Date:
Fri, 27 Sep 96 09:04:00 CDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 

Does anyone have any information on the above topic?  I am interested in 
knowing what the Relative Humdity should be in an area of pcb storage to 
minimize outgassing problems for wavesolder.  IPC Ansi J Stnd.  says 70% RH 
or less but, should not be below 30% due to ESD concerns.  Is there a 
defined "Sweet Spot" for RH levels to reduce outgassing problems?  How long 
does it take for a pcb to "soak up" moisture?  Any information/comments 
appreciated.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************

ATOM RSS1 RSS2