Jos, (I had to send this back to TechNet because when I sent it direct
           it came back! I realize you have a big problem and you are 
           asking for some direction)
     
        OK. Now I understand on the antitarnish! I've never ran that 
     process myself. I have always ran DMAB or post oxide dip (reduction. 
     Like McDermid's process OmniBond+ which is what I run right now.) 
     You should not have the separation at oxide to copper. That's crazy. 
     That sounds like the problem was in preparing the copper surface 
     before oxide. That's why I said maybe microetch. (Also, another 
     billboard is talking about international supplies of contaminated 
     "CP" grade sulfuric acid. You might want to check that out!) If 
     something like tin or high amounts of copper were in your microetch, 
     it could possibly co-deposit when processed and produce a easily 
     separable layer.
        Are you running FR-4 (Tetra or multifunctional?) or BT or 
     Polyimide? What is the material? The temperature (press cycle) and 
     oxide thickness makes a big difference. (High temp materials need 
     thin oxide deposits)
        Talk to me some more. I've been in charge of lamination areas for
     around 20 years and understand how this process works.
     
     Dave Hoover
     
     
     
______________________________ Reply Separator _________________________________
Subject: Re:FAB Delamination
Author:  [log in to unmask] at SMTPLINK-HADCO 
Date:    5/31/96 3:22 AM
     
     
Dave.
When I say antitarnich I min antitarnich.
This step protect the reduced BO (DMAB) agains re-oxidation, so you can hold 
boars more then 48 h before pressing without pink ring problems.
I don't think that it have nothing to do with delamination.
Can you explain a little bit more about microetch? Wy do you think  it could 
cause the problem?.
We are making an experiment to find the relevant cause of this kind of 
delamination. I can inform you if you are interested.
     
Jos=E9 Muelas.
     
     
     
At 06:51 28/05/96 EST, you wrote:
>     Antitarnish????
>     Do you mean post oxide process?? 
>     (Like DMAB?)
>    =20
>     (Sounds like your microetch was spent or contaminated. Did somebody 
>     run double treat through it?)
>    =20
>     Dave Hoover
>
>
>______________________________ Reply Separator 
_________________________________
>Subject: Delamination
>Author:  [log in to unmask] at SMTPLINK-HADCO 
>Date:    5/27/96 10:39 AM
>
>
>We have detected a large delamination on all boards from one of our=20 
>production batches. This delamination appears in the SMT IR oven (short=20 
>wave) step in our customer facility.
>Curiously the delamination takes place between black oxide and base copper= 
=20
>interface. In other words, the black oxide layer peels away from his own=20 
>base copper and remain stick on epoxy resin. The stripped Cu appears pink. 
>    =20
>We suppose that we made a mistake in B.O. process but we don't know where= 
=20
>exactly.
>Our B.O line has de following steps:=20 
>Sodium persulfat microetching
>Black oxide (Shipley)
>Oxide reduction (Shipley)
>Antitarnish and rinse
>Hot air drying.
>Did somebody hear about this kind of delamination?. If yes, which is  the= 
=20
>B.O. wrong parameter?
>Excuse my English.                                                thanks in= 
=20
>advance.
>    =20
> Jos=3DE9 Muelas
>    =20
>
>