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Call For Abstracts - INTERpack '97
The PACIFIC RIM / ASME International, Intersociety Electronic & Photonic
Packaging Conference
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"An International Exchange of State-of-the-Art Knowledge Pertaining to
Engineering Practice in Research, Development, Manufacturing, and
Application of the Science & Technology of Electronic & Photonic Packaging"
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Hotel Orchid at Mauna Lani
Kohala Coast, Island of Hawai'i, USA
June 15-19, 1997
Sponsored by:
THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS INTERNATIONAL (ASME)
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Invited Participating Societies:
The Japan Society of Mechanical Engineers (JSME) / The Institute of
Electrical & Electronics Engineers (IEEE)
International Electronic Packaging Society (IEPS) / The International
Society for Hybrid Microelectronics (ISHM) / Society of Plastics Engineers
(SPE) / Optical Society of America (OSA) / Materials Research Society (MRS)
/ Japan Welding Society (JWS)
Japan Institute for Interconnecting and Packaging Electronic Circuits (JIIPEC)
The Institute of Electronics Information and Communication Engineers (IEICE)
SHM-The Microelectronics Society JAPAN / The Japan Society for Composite
Materials (JSCM)
Japanese Society for Strength and Fracture of Materials (JSSFM) / The
Japanese Society for Non-Destructive Inspection (JSNI)
Society of Automotive Engineers of Japan, Inc. (SAEJ) / The Society of Naval
Architects of Japan (SNAJ)
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CONFERENCE OBJECTIVES
International cooperations, understanding and promotion of efforts and
disciplines in Microelectronics, Optoelectronics, and Photonics Packaging
Engineering in an East/West business setting. Dissemination of knowledge
pertaining to the art, science and practice in Electronic and Photonic
Packaging Engineering will serve as the foundation upon which the conference
program will be developed.
Advisory Committee: A. Bar-Cohen, T.R. Hsu, A.D. Kraus, S. Matsuoka, W.
Nakayama
General Chairs: E. Suhir (US), M. Shiratori (Japan)
Program Chairs: Y.-C. Lee (US), G. Subbarayan (US)
International Liasons: H. Abe, I. Ikegami (Japan); Y.-H. Hung, A. Lin
(Taiwan); K.W. Paik (Korea); M. Sceats (Australia); A. Tay (Singapore); A.
Tylikowski (Poland), D. Whalley (UK); E. Zakel (Germany), Johan Liu
(Sweden).
Program Committee: includes the international liasons and other leading
specialists in the field.
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KEYNOTE SPEAKERS
R. Hanneman (US), J. Hwang (US), F. Ishitsuka (Japan), M. Pecht (US), R.
Tummala (US)
INVITED SPEAKERS
Partial list of invited speakers includes: H. Abe (Japan), D. Agonafer (US),
P. Ayyaswami (US), A. Bar-Cohen (US), W.T. Chen (US), H. Conrad (US), R.
Darveaux, (US), C. S. Desai (US), P. Engel (US), J. Fillo (US), D. Frear (US),
L. Goldmann(US), G. Grimes (US), C. Handwerker (US), P. Haugsjaa (US),
Y. Hiruta(Japan), W.K. Jones (US), N. Koopman (US), J. Lau (US), C.K. Lim (US),
A.Lin (Taiwan), R. Mahajan (US), S. Matsuoka (US), L.L. Moresco (US),
L.Nguyen (US), W. Nakayama (Japan), S.-Y. Oh (Korea), Y. Pao (US),
R.Pryputniewicz (US), B.G. Sammakia (US), M. Sceats (Australia), M. Shiratori
(Japan), T. Suga (Japan), E. Suhir (US), A.A. Tay (Singapore), Y. Tsukada
(Japan), E. Zakel (Germany), D.J. Williams (UK), C.P. Wong (US).
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WHO SHOULD ATTEND?
Researchers, designers, technical managers, electronic and photonic
packaging system developers and users involved in Microelectronic and
Photonic Packaging. The technical program will have strong technical content
and will include panel sessions, paper presentations and short courses
(tutorials) addressing both fundamental and applied aspects of the "high
technology" engineering as related to the field of packaging. Paper
presentations will be published in the conference proceedings. The mix of
speakers, geographical origins and technical backgrounds will be very broad.
Particular emphasis will be placed on East/West technology transfer and
mutually beneficial business opportunities/ applications contained within a
cooperative international electronic packaging industry environment.
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TUTORIALS
Inter-society sponsored tutorials will be featured as part of the INTERpack
'97 program. Each tutorial will focus on technology transfer and the
associated business opportunities present within research & development,
manufacturing & application of Electronic & Photonic Packaging.
PUBLICATIONS
As a joint, East/West Inter-society publications event, INTERpack '97 will
also feature the latest in Electronic & Photonic Packaging publications and
supporting materials on topics such as Microelectronics, Optoelectronics &
Photonics Packaging engineering.
EXHIBITION
Industrial/research exhibits featuring both Pacific Rim and Western
products/technologies will be open to all conference participants.
To be included in the conference as an exhibitor or to receive further
details regardings these and other yet-to-be announced INTERpack '97 special
program features, please complete the Intent to Participate form and return
to the address listed. You and/or your organization will be contacted.
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