A question re: board repair. When selectively re-plating a gold edge 
contact, using a procedure like IPC-R-700 4.2.3.1, a voltage is applied 
between a cathode and the (anode) plating swab. This voltage varies 
between 3V and 8V, depending on the plating or cleaning solution to 
be used. 

One of our customers has queried the possible damage such voltage might
do the the components on his board. My thoughts are that the voltage and
current will be confined to the plating area, and will not get to the
components. To ensure this, either a) the gold fingers to be selectively 
plated should be temporarily "bussed" to keep them all at the same
potential or b) if a single finger, then all surrounding area should be
tape masked to prevent plating solutions and/or accidental voltage getting
to it.

Has anyone else considered this a potential problem? ((Excuse pun...))

Peter

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Peter Swanson                                         Oxfordshire, England
INTERTRONICS
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