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Date: | Fri, 9 Aug 1996 10:23:53 -0500 |
Content-Type: | text/plain |
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We are attempting to switch our pre-clean process prior to soldermask from
chem-clean followed by a mechanical scrub to chem-clean only. We have
experienced problems with poor soldermask adhesion at the nickel/gold tab
area. We are using a reverse current tin/lead strip prior to nickel/gold
and the HCL seems to be getting under the mask causing it to peel. Has
anyone else had experience with a chem-clean process prior to soldermask
and reverse current plate prior to nickel/gold.
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