We are attempting to switch our pre-clean process prior to soldermask from chem-clean followed by a mechanical scrub to chem-clean only. We have experienced problems with poor soldermask adhesion at the nickel/gold tab area. We are using a reverse current tin/lead strip prior to nickel/gold and the HCL seems to be getting under the mask causing it to peel. Has anyone else had experience with a chem-clean process prior to soldermask and reverse current plate prior to nickel/gold. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************