We are attempting to switch our pre-clean process prior to soldermask from
chem-clean followed by a mechanical scrub to chem-clean only.  We have
experienced problems with poor soldermask adhesion at the nickel/gold tab
area.  We are using a reverse current tin/lead strip prior to nickel/gold
and the HCL seems to be getting under the mask causing it to peel.  Has
anyone else had experience with a chem-clean process prior to soldermask
and reverse current plate prior to nickel/gold.

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