Brad,
One suggestion I have if the blind vias are on one side of the panel would be to
run the panel at an angle in your plating rack so that the blind vias are
tilting up. The air bubbles should float out of the vias more easily.
Also, where are you running vibration? My suggestions would be to run vibration
in the following locations:
Swellent in the desmear line
Cleaner conditioner in the PTH line
Electroless copper
Acid cleaner in the pattern plate line
Flouboric acid in the pattern plate line
Also NOTE: My experience is that the amount of vibration used is often
inadequate, i.e., the vibrators are too small for the work going through the
process.
Dave Sullivan
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: FAB:Controlled Z drilling for blind or buried vias
Author: [log in to unmask] at ccmgw1
Date: 11/15/96 1:42 PM
We are evaluating all of the techniques and methods for doing controlled
z drilling with plate thru holes. We have done a few boards like this
and
had marginal success with getting the plating solution in the air
trapped
hole.
We have tried some of the tricks that we are aware of,i.e., agitation,
vibration,
larger aspect plating ratios, and air sparging.
Does anybody out there know of any other methods that we haven't tried?
Any comments
would be appreciated.
Thank you,
Brad Reese
Cirtech Inc.
<714> 921-0860 X222
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