I would like to see IPC's response on this subject because I'm under
     the assumption that nailheading is no longer a reason for rejection.
     (I've also been told that somewhere somebody ran tests and found 
     increased holewall adhesion due to the nailheading<increased cu to cu
     plated sites>)(?????)
     I would think that only in the case of positive etchback requirements
     would nailheading really create an issue.
     Am I correct or wrong in my thinking?
     
     Groovy


______________________________ Reply Separator _________________________________
Subject: Nailheading
Author:  [log in to unmask] 
Date:    1/31/96 12:19 PM


Simple Question: 
     
Has anybody found a functional defect in multilayer pwb's due to nailheading???
     
D.Rooke
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