>----- Forwarded message (MIKE CUSACK <[log in to unmask]>) -----< 
 
 
* New Engineering Position *							 
May 7, 1996 
 
Multichip Package Engineering Position 
AMI Multichip Products Division 
 
Duties and Responsibilities 
 
1. Devise multichip packaging solutions and create circuit layouts,
employing  
standard MCM subcontract manufacturing processes, materials, design rules,
and  
methodologies. 
2. Interface with all internal groups, vendors, and customers regarding  
multichip packaging of bare silicon die and packaged microelectronic  
components. 
3. Document designs, receive, convert, and transfer electronic files
to/from  
customers and suppliers. 
4. Create, track, and report project progress. 
 
Minimum Qualifications 
 
Eng 1 - BS degree in Electrical Engineering plus 0 - 1 year of course work
or  
experience in layout, design, or assembly manufacturing of electronic
systems. 
 
Eng 2 - BS degree in Electrical Engineering plus 1-3 years of directly
related  
experience in layout, design, or assembly manufacturing of electronic
systems. 
 
Experience Desired 
 
1. Understanding of CAD layout tools, such as AutoCAD or Mentor MCM
Station. 2.  
Experience with personal computer software tools, networking, and file
transfer  
protocol and conversions. 
3. Experience with use of electronic semiconductor and discrete components
in a  
system environment. 
4. Working experience with printed circuit board or hybrid assemblies. 5.  
Subcontractor qualification/administration experience. 6. Comfortable with 

telephone and written communication. 
 
 
 
For more information, contact: 
 
Mike Cusack 
AMERICAN MICROSYSTEMS, INC. 
Multichip Products Division 
2300 Buckskin Road 
Pocatello, Idaho 83201 
 
Tel:	208-234-6607 
FAX:	208-234-6695 
e-mail:	[log in to unmask]