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1996

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Subject:
From:
Bob Willis <[log in to unmask]>
Date:
01 Aug 96 01:47:09 EDT
Content-Type:
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First what is the specification you have quoted, sorry I have not heard of this
document unless it also goes by another name.

It may be the case that during the solder wave immersion the plating is being
removed and hence non wetting.

It may be the case that the temperature of the part is low leading to spiking on
the part.

You need to look at some of the parts to see the problem.

Bob Willis
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/bwillis
Email: [log in to unmask]


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