First what is the specification you have quoted, sorry I have not heard of this document unless it also goes by another name. It may be the case that during the solder wave immersion the plating is being removed and hence non wetting. It may be the case that the temperature of the part is low leading to spiking on the part. You need to look at some of the parts to see the problem. Bob Willis Electronic Presentation Services 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Home Page: http://ourworld.compuserve.com/homepages/bwillis Email: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************