I would like to thank the people that gave me input on what they would like
to see in a Symposium devoted to PCB soldering. We took your input and had a
meeting with our technical steering committee, and would like to review the
results with you. Also, if you know of specialists in any of the key areas
that we should approach to talk at the Symposium, we would appreciate your
input. Please send the information directly to Gary Arnold (see below)
instead of tying up the forum.
I have tried a couple of times to send this with Gary's input as an
attachment, but it does not seem to go through. If you do get duplicate
copies, I apologize....
>
>>
>The Watson School of Engineering at Binghamton University is compiling the
>program for the 1996 Soldering Technology Symposium. This year's program
>will examine emerging developments and technology applications relating to
>process and assembly for carrier preparation. We ask you to review the major
>categories selected by the symposium task group and suggest speakers or
>specific topics that you believe would be of interest to the packaging
>community. Responses may be directed to Gary Arnold at
>[log in to unmask] by Fax at 607-777-4411 or telephone at 607-777-2154.
> Ninth Annual
> Soldering Technology for Electronics Packaging Symposium
> October 21 and 22, 1996
> Carrier Preparation: Interconnection, Process and Assembly Challenges
>
>I. Keynote Session: What are the Drivers for new Soldering Technologies?
>(This session should provide an overview of the issues that will determine
>the selection of future soldering technologies. We hope to communicate a
>sense of direction for soldering technologies or to indicate a pattern of
>technology evolution)
>
>II. Solder Mask and Screen Developments
>(Technical sessions are sought which describe new solder mask and screening
>developments addressing such areas as close dimension applications, improved
>electrical performance, resistance to moisture, packaging robustness,
>manufacturaability, and reliability) Some topics might include:)
>- LPISM (liquid photo imagable solder mask) - PID (photo imagable dielectric)
>
>III. Solder Applications
>( Technical papers are sought addressing process technologies which prepare
>the board for assembly of a number of component technologies such as BGA,
>CSP, Flip Chip, and fine pitch SMT packages. Techniques to assure evenness
>of colder coat, volume control, fine pad/close place deposition. Typical
>processes might include the following:)
>- HASL - Screen - Plate - Pre-Form - Lift-off - Solder Jetting
>
>IV. Surface Finish Issues and Developments
>(Technical sessions are sought which address process or technology
>developments which 1.) Improve solderability of board for component
>attachment, 2.) Pad prepared for wire bond or DCA application, 3.) Component
>lead preparation for board attachment. Sessions might include such topics as:)
>- ENTEK - Nickel/Gold (NiAu) - Tin/Lead (SnPb -Palladium/Nickel(PdNi) -
>Palladium/Nickel (PdNi) - Lead Finish - Tin/Lead (SnPb)- Lead/Nickel
>Component :- Nickel/Gold (NiAu) - Silver
> -Palladium/Silver (PdAg) - Palladium/Nickel (PdNi)
>
>V. Joining Mechanisms
>(Technical sessions are sought which describe emerging developments and
>technologies relating to new developments in alloys, assembly techniques,
>reflow process development, tools, rework and no-clean fluxes. Some topics
>might include or address:)
>- Alloys - Lead Finish - Equipment - Epoxies - Attachment - Electrical
>Connection - Compression Connections
>
>VI. Reliability Issues
>(Technical sessions are sought to illustrate real-life performance of
>various techniques, materials, and processes)
>
>------------------------------------------
>Gary J. Arnold
>Binghamton University
>Thomas J. Watson School of Engineering and
>Applied Science
>Office of Continuing Education
>Phone:607 777-2154
>Fax: 607 777-4411
>E-mail: [log in to unmask]
>--------------------------------------
>
>
Ron Gedney
[log in to unmask]
607-777-4335, fax 4683
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