Any experience out there with processing Getek material?
     
     Specifically:
     - Can positive etchback be achieved with sodium permanganate
       (i.e., without plasma or chromic)?
     - Is it compatible with both EDTA and DMAB-based oxides?
     - How critical is the published "6-9 deg.F uniformly through the 
       press book" heat rise?
     - How repeatable are raw laminate shrinkage factors? (similar to FR4 
       or drastic like polyimide)
     - What post-drill bake, if any, is required prior to etchback?
     - Any problems with this bake degrading the oxide adhesion?
     - Any success stories with direct metallization?
     - Is gassing at desmear & electroless more,less or the same as FR4s.
     
     Designers:
     - What's the driving force for this genre of material?
     - Is it just Dk and dissipation factor or is there something more?
     - Is Neltec's N4000-13 (non-PPO mat'l) a true equivalent?
     - Are there any others?
     - Is this where the board industry is going?
     
     Lots of questions, hoping for some answers.
     Thanks in advance.
     J. Felts
     PC World, Toronto