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Subject:
From:
"BILL RUGG" <[log in to unmask]>
Date:
Wed, 19 Jun 96 12:44:08 MDT
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Hi Suzanne

The only references found to date is the ANSI/J-STD-001 Joint Industry 
Standard. Under section 9.0 Assembly Requirements their is a Bow and 
Twist(Warpage) specification 9.2.3. 

If you find something else please let me know. Hope this helps..

Does anyone have any good references on flexing of printed wiring boards 
and 
surface mount component (chip) fracturing?



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