Though the HASL process may be considered a severe test for solder 
     mask adhesion, the lack of adequate adhesion does not always reveal 
     itself at this process. 
     It has been my experience, more times than maybe I'd like to admit, 
     that I have shipped product to my customer believing that the solder 
     mask adhesion was adequate, later to find out that it did not hold up
     to their wave soldering process. 
     This does not in any way indicate that it is always the board 
     fabricators process either.
     There are many different factors that can influence solder mask
     adhesion.
     
     I'm with you Paul, not enough information has been shared to be able
     to establish a conclusive answer to this problem.

     Terry Pearo
     Marcel Electronics

______________________________ Reply Separator _________________________________
Subject: Re: Re[2]: Soldermask peeling
Author:  [log in to unmask] at Internet
Date:    12/9/96 4:09 PM


In your message dated Monday 9, December 1996 you wrote : 
>      SMOBC
>      Funny, no one has thought to mention that it may be the 
>      Fabricator's application for the defect. Is that not a 
>      possibility?
> 
The HASL process normally used to produce SMOBC is a pretty severe test of 
solder mask adhesion unless these have not been HASLed. Maybe they are 
Nickel/Gold or some other finish. As others have noted, we still crave more 
complete information as guessing in the dark is not much help.
     
Paul Gould
     
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