TechNet,
As a result of what appears to be delamination during the assembly
process I have made a comparison between my copy of IPC-A-600, Rev.
E, 1995 and IPC-A-610, Rev. B, Amendment 1, 1996 and I would like to
here further arguments between the acceptable Pink Ring as pictured on
page 19 of my IPC-600 and the unacceptable delamination pictured on
page 82, figure 8-11, of my IPC-610. If Pink Ring is evidence of bond
separation, how can this be acceptable at the fab level and then
unacceptable at the assembly level? Please comment.

Thank you.
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