Is anyone out there using a NDT solderability analyzer that employs sequential
electrochemical reduction analysis (SERA)?  The method is supposed to
characterize metal oxides, intermetallics, and organic compounds on soldering
surfaces.   Some large OEMs (and frequent TechNet users) are listed as users
of this technology, and I'm interested in hearing if this technique provides a
good assessment of solderability.

Does it correlate well with how "fresh" components perform in production?

Does it correlate well with how "steam-aged" components perform in
solderability testing?

How much engineering support is needed and is it easy enough for production
operators to use?

How well does it work with lead-tin replacement finishes such as the various
Pd, Ni/Pd, Au flash multilayer plating processes now being used by component
and PCB suppliers? 

Any responses from users of the technology would be appreciated.  Thanks in
advance.

Tracy Tennant
Micron Technology, Inc.
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