SOLDER SYMPOSIUM - AREA ARRAY PACKAGING:

>The Watson School of Engineering Office of Continuing Education will be
hosting the Ninth annual Solder Symposium just ahead of the IEEE BGA/Flip
Chip Workshop in the same hotel. The Solder Symposium will concentrate on
getting solder on the PCB for area array componentry complementing the IEEE
conference.
>
>The Solder Symposium is is a different format from the IEEE Workshop in
that it is geared more toward education and full papers or presentations
will be provided to attendees. It is slightly more tutorial in nature with
papers taking approx. one hour. The authors are carefully selected to be
experts in the field with lots of experience on their topics and able to
provide detail answers on questions. The Symposium will cover solder mask
and screen developments; solder application; surface finish issues; joining
mechanisms; and reliability issues.
>
>Advance programs and registration information can be obtained from Gary
Arnold (607-777-2154, fax 4411) or e-mail ([log in to unmask]). The
program is also available on the IEEC Home Page
(http://www.ieec.binghamton.edu/ieec/ - look under IEEC Events.
>
>If you are working in the field of area array packaging, you should
consider attending both the solder symposium and the IEEE workshop - then
you will be really up to date!
>
Ron Gedney
[log in to unmask]
Integrated Electronic Eng. Center
Watson School of Eng. & Applied Science
Binghamton University
P.O. Box 6000
Binghamton, NY 13902
607-777-4335, fax 4683

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