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Subject:
Re: immersion/electroless tin plating
From:
"ddhillma" <[log in to unmask]>
Date:
Tue, 30 Jul 96 13:20:13 cst
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     Hi!
     
     Try get copies of the following references - they have some good data 
     on immersion tin:
     
     Journal of Electronic Materials, Vol. 25, No. 7, 1996
     "Interfacial Reactions During Soldering with Lead/Tin Eutectic and 
     Lead Free Tin Rich Solders" Kang,Rai,Purushothaman
     
     Journal of Electronic Materials, Vol. 25, No. 7, 1996
     "Wave Soldering with a low Melting Point Bi-Sn Alloy: Effects of 
     Sldering Temperatures and Circuit Board Finishes", McCormick, Artaki, 
     Jin,Jackson,Machusak,Kammlott,Finley
     
     IEEE Transactions on Components, Packaging,and Manufacturing 
     Technology, Part A, Vol.18, No. 1. March 1995
     "Influence of Temperature and Humidity on the Wettability of Immersion 
     Tin Coated Printed Wiring Boards", Ray, Artaki,Vianco
     
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]
     


______________________________ Reply Separator _________________________________
Subject: immersion/electroless tin plating
Author:  [log in to unmask] at ccmgw1
Date:    7/30/96 11:02 AM


     
To: IPC; PCBFab
From: Lee-CTUA065 Bab-Hui on Tue, Jul 30, 1996 10:27 PM 
Subject: immersion/electroless tin plating
     
Any body out there has experience in using immersion tin or electroless tin 
as a final surface finish on PCBs for solderability application? Currently 
what types of product are available in the market & who are the major 
chemical suppliers? Appreciate if anyone can provide an answer. Thanks.
     
Regards,
B.H. Lee
Process Engineer
     
Motorola Electronics Pte Ltd
Printed Circuit Board Operations
76, Pioneer Road
Singapore 639577
Republic of Singapore
     
Fax: ++65-8630233
email: [log in to unmask]
     
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