These whiskers are called 'Conductive Anodic Filaments (CAF). There has been
significant work done in this area at Bell Labs some 15 years ago or so. You
may check Appendix C 'Design for Reliability (DfR) for Insulation Resistance'
of the just released IPC-D-279 'Design Guidelines for Reliable Surface Mount
Technology Printed Board Assemblies'. Also a Surface Mount Council White
Paper in the SMI'95 proceedings 'Design for Reliability in Advance Electronic
Packaging'
by W. Engelmaier and L. Turbini.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]
	
Werner Engelmaier
President
Engelmaier Associates, Inc.
Mendham, New Jersey
Laura J. Turbini

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