We have been exhibiting miniature size nodules on our panels for quite
some time. These miniatue nodules resemble a slightly high brightner
burn. 
I was wondering if anybody can give me a few suggestions to where I
should look. 
 
Afew test I have ran were with bare laminate through a scrubber before
plating. Nodules appeared on them. 
 
Afew more experiments were ran through different preclean lines and all
led to the same result, nodules.

My questions if anybody could help are:
1. Would a rectifier with too high ripple affect the leveling of copper
plating?
2. We currently hot load our racks into the bath, the program is set up
with a five second lag  and raises from 0 amp to calculated amperage. So
the panel sees 5 seconds of 0 amps before the rectifier applies voltage.
Could this be a contributor? 

Timothy Gaylor

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