A test was ran of 20 pcb's 10 of them were fluxed with a AT&T LSF 2000 spray 
fluxer, the other 10 were ran with a foam fluxer.  The boards were not 
preheated or soldered and the flux residue was allowed to dry from the 
boards.  The boards were then tested for contamination.  The boards that 
were foam fluxed came out about 10 NaUgcl cleaner then the boards ran with 
the spray fluxer.  This was shocking to many of us.  We are and were under 
the impression that spray fluxers apply not only a more even layer of flux 
but also less of it.  Can anyone offer any insight to this?  the flux used 
is a 1.5 % solids no clean flux.  And yes the specific gravity of the flux 
was constant in both application methods.  Thanks in advance for your imput.



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