Subject: | |
From: | |
Date: | Mon, 26 Aug 1996 22:02:30 -0400 (EDT) |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
I would like to know if somebody has the experience of wet lamination in a
process using MLS or Dstf copper on base laminate for innerlayer core.
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|