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1996

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Subject:
From:
Poh Kong Hui <[log in to unmask]>
Date:
Thu, 28 Nov 1996 21:49:16 +0800 (SST)
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Hi Technetter,

Could anyone tell me is there any way to reduce the gold leaching from a gold
plated board. I am having dull solder joint after reflow.

I have heard that hot air reflow will have more gold-leaching as compared to
Infrared reflow. Please enlighten..



+====================================+
Kong Hui  Poh
Process/Equipment Engineering Advisor..
Techgate Electronics
Email: [log in to unmask]
=-=-=-=-=-= -=-=-=-.=.=.=.=.=.=.=.=.=.=.=.=. =.=.=.


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