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From: | |
Date: | Thu, 28 Nov 1996 21:49:16 +0800 (SST) |
Content-Type: | text/plain |
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Hi Technetter,
Could anyone tell me is there any way to reduce the gold leaching from a gold
plated board. I am having dull solder joint after reflow.
I have heard that hot air reflow will have more gold-leaching as compared to
Infrared reflow. Please enlighten..
+====================================+
Kong Hui Poh
Process/Equipment Engineering Advisor..
Techgate Electronics
Email: [log in to unmask]
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