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Date: | Thu, 21 Nov 1996 12:57:26 EST |
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The normal specification is 0.5-0.15um of immersion gold over 4-8um
electroless nickel.
I would add that we run our process at 0.7um gold over 5-6um nickel
Thicker deposits of gold (>0.15um) can cause issues with solderability
Dougal Stewart, Exacta Circuits, Scotland
from: [log in to unmask] subject: fabrication
What are PCB mfg's requesting for emersion gold over nickel
thicknesses these days.
Jeff Neisess EMAIL [log in to unmask]
Eurotherm Controls, Inc
11485 Sunset Hills Rd.
Reston, VA 20190 USA
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