Several professors at Binghamton University have been working on a study of
the flow of flip chip underfill materials with the support of a DARPA
contract, as well as funding from the IEEC and local industry. They plan to
take advantage of the IEEE BGA/Flip Chip Workshop Oct. 23-25, 1996, being
held in Binghamton, to have a workshop on underfills on Thursday night, Oct.
24, 1996, at the Regency hotel. A number of encapsulant suppliers and users
will be in attendance at the BGA/Flip Chip Workshop and wish to take
advantage of this opportunity to hold a focused discussion on the flow of
underfill materials in the manufacture of DCA (or COB) packages. The
workshop will be held from 6:00 p.m. to 9:00 p.m. at no charge, and will
include dinner if registration is received before the day of the Workshop.
You must register separately from the BGA/Flip Chip workshop. Sandy Marsh
(tel. 607-777-4332; fax 607-777-4683; e-mail [log in to unmask]) will
accept registrations (send name/address/tel no., etc.) for the Underfill
Workshop. If you want more information on the IEEE BGA/Flip Chip Workshop,
send a note to me or to Sandy. 

If you have any technical questions about the Underfill Workshop per se,
call Professor Eric Cotts, Binghamton University, at 607-777-4371, fax
607-777-2546.
Ron Gedney
[log in to unmask]
Integrated Electronic Eng. Center
Watson School of Eng. & Applied Science
Binghamton University
P.O. Box 6000
Binghamton, NY 13902
607-777-4335, fax 4683

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