<<In the previous message I forgot to add that the major benefit in wet 
lamination is with innerlayer processing for opens and near opens. >>

Very good point!  Outer layer boards (with through-holes) can be scrapped 
if the small holes (about 16 mils or less) are dried thoroughly before 
lamination.  The moisture in the holes can create a vacuum in the holes 
when the board cools, which pulls the dry film into the hole.  The dry 
film can lock-in just inside the knee of the hole & won't be developed 
out.  It then inhibits the pattern plating & causes voids.


Matt Byrne
     
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