We at Velie Circuits have been building blind via boards for many years.
 Both methods of fabrication, "control depth drilling" and "sequential lam"
work very well. We use the sequential lam process over drilling when ever the
design allows us to do so for it does not require the need for depositing
electroless copper into a blind hole. This can be done and we do it but if
the via is deep,  it can be a problem.  Give us a call if you need futher
feedback.  (714) 751 4994.
Good luck,

Larry Velie

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