Some colleagues have a series of questions about intrusive soldering 
(paste in hole).  Any responses would be greatly appreciated.

1. Regarding workmanship standards for intrusive reflow, We are planning 
on using IPC (IPC-A-610) workmanship standards, but call the screenprinted 
side the "secondary side".

We would appreciate any comments!

2. Has anyone developed workmanship standards more specific to intrusive 
reflow soldering than those listed in IPC-A-610?

3. Most of the components we are planning to use this process on have the 
leads placed such that it will be difficult or impossible to inspect the 
solder joint from the screenprinted side of the board, which is where we 
are hoping to get the good solder fillet. From a practical inspection 
standpoint, the only thing it looks  like we can tell our touch-up 
operators is that the solder joint should be considered OK if there's 
solder visible in the hole when inspected from the opposite side of the 
board. This has us feeling a little uncomfortable 
... how are other people handling this?

4. Since the solder joints will be difficult to inspect, it becomes ever 
more 
important that we control this process up-front. What are the key 
parameters 
that others have found, specific to intrusive reflow soldering?

Thanks in advance