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Date: | Wed, 26 Jun 96 14:57:00 CDT |
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As you know, gold dissolves extremely rapidly in molten solder compared
with other metals. Some of you might have experienced the effect of solder
splash or balls landing on gold plated surfaces which contaminate the gold
surface finish. Typically, tape or sheath is used to protect the gold plated
surface (gold fingers) from solder contamination. Recently, we found some
gold plated assemblies that exhibited no contamination on the gold surface
even when solder balls or splash landed on the surface. The strange thing
is that no solderability problem has been reported on any gold plated SMT
pads. Can someone comment on this phenomenon!!
Thanks
Blue Smurf
Here is some additional info.
Electroplated Ni thickness: ~ 100 micro inch
Electroplated Gold thickness ~40 micro inch
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