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| Date: | Thu, 31 Oct 1996 19:18:05 -0500 |
| Content-Type: | text/plain |
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There is a reliability problems with those parts.
Baking of parts may only "fix" problems at the semiconductor level not the
package level.
You should submit devices for moisture classification and possibly for
reliability testing.
If you need to find a good lab please contact me via e-mail at
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