 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vJ9xm-0000S7C; Thu, 31 Oct 96 21:08 CST |
| Old-Return-Path: |
|
| Date: |
Thu, 31 Oct 1996 19:18:05 -0500 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| From [log in to unmask] Mon Nov 4 09: |
46:20 1996 |
| Resent-Message-ID: |
<"7XmnV3.0.H1F.LcMUo"@ipc> |
| Subject: |
|
| From: |
|
| Return-Path: |
<TechNet-request> |
| X-Loop: |
|
| Message-ID: |
|
| Parts/Attachments: |
|
|
There is a reliability problems with those parts.
Baking of parts may only "fix" problems at the semiconductor level not the
package level.
You should submit devices for moisture classification and possibly for
reliability testing.
If you need to find a good lab please contact me via e-mail at
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
