Thanks for the mail details about details about my video tapes and the wave
solder evaluation board are provided here. Thanks for your interest.

Wave Solder Test Board and Evaluation Procedure

Bob Willis
Electronic Presentation Services
2 Fourth Avenue
Chelmsford 
Essex CM1 4HA
England.

Tel:  (44) 01245 351502                                     
Fax: (44) 01245 496123
Email:[log in to unmask]

Introduction

The wave solder test board is designed to evaluate the soldering performance of
various soldering fluxes under different soldering conditions. The results can
then be assessed against previous production trials.

The test board also allows solder masks to be assessed to evaluate the rate of
solder balling with different flux or varying fabrication or assembly
conditions. The soldering performance of alternative Solderable coatings like
copper, nickel/gold, silver and tin/lead can also be assessed.

The specially designed test board provides repeatable results for any evaluation
programmes without the need for components. This significantly reduces the time
and cost of any process trials. 

Guidance on setting up a wave soldering process is also provided together with a
recommended method of comparing process results and parameters.

When results have been gained for a combination of flux, resist or machine
settings then the test board may also be used for process optimisation or
continuous process monitoring.

The test board design consists of different design features including round
solder pads, large earth plains and fine line sections. In each case the
features are mounted in different directions to aid process evaluation.

The different pad features and sizes are detailed on the accompanying drawing
and listed.

An example form is provided to allow the collection of data regarding trials
using this special board design. As this board becomes used by other companies
the results obtained by other users may be available for exchange.

The test boards design files are obtained direct from Electronic Presentation
Services. The disk may be obtained containing the Gerba design files which may
be used to produce your own test boards from your normal circuit board supplier.

The standard test board available from EPS features solder mask over bare copper
with pad and tracks defined. It is made from FR4 laminate and solder mask
coated.  

An alternative technique for defect data collection is also available as a
spreadsheet. This provides an effective method of recording PPM Parts Per
Million defects during production. It is provided with a training video so that
defect data collection using the spread sheet or manual forms is undertaken
correctly.

Test Board Sites and Result Sheet

Position 1:	Solder Ball Count Round Pads 0.050"

Position 2:	Solder Ball Count Round Pads 0.050"

Position 3:	Solder Ball Count Round Pads 0.050"

Position 4:	Solder Shorts Track Width 0.005" Gap 0.008"

Position 5:	Solder Shorts Track Width 0.005" Gap 0.008"

Position 6:	Solder Ball Count Round Pads 0.050"

Position 7:	Solder Ball Count Round Pads 0.022"

Position 8:	Solder Ball Count Round Pads 0.022"

Position 9:	Solder Ball Count Round Pads 0.022"

Position 10:	Solder Ball Count Round Pads 0.050"

Position 11:	Solder Ball Count Round Pads 0.050"

Position 12:	Solder Shorts Track Width 0.005" Gap 0.008"

Position 13:	Solder Shorts Track Width 0.005" Gap 0.008"

Position 14:	Solder Shorts Track Width 0.005" Gap 0.008"

Position 15:	Solder Shorts Track Width 0.005" Gap 0.008"

Position 16:	Solder Shorts Track Width 0.005" Gap 0.008"

Position 17:	Solder spikes solid copper area

Position 18:	Solder Shorts Track Width 0.004" Gap 0.006"

Position 19:	Solder Shorts Track Width 0.004" Gap 0.006"

Position 20:	Solder Shorts Track Width 0.004" Gap 0.006"


Introduction to Inert Soldering
Duration: 45 minutes 

modern assembly processes
inert gas advantages
benefits of nitrogen soldering
inert reflow/wave soldering
solder balling
nitrogen gas supply
cost justification
copper finish boards
Colin Lea/Chris Tanner/Bob Willis interviews


Introduction to BGA Technology
Duration: 55 minutes 

Component types
Design requirements
Screen print and reflow process
Inspection and quality control
Rework and repair
Process problems and solutions


Wave Soldering Process Control
Duration: 28 minutes
   
Wave soldering process
Soldering materials
Process parameters
Setting process parameters
Quality control checks
Common soldering defects


Guide to Solder Paste 
& Screen Printing
Duration: 55 minutes   

Solder paste selection
Screens and stencils
Practical machine setting
Solder paste thickness measurement
Quality control standards
Common screen printing defects


Wave Solder Defect Monitoring
Duration: 25 mins + spreadsheet

Wave solder introduction
Solder yield calculation
Manual & automatic charts
Practical examples
Wave solder defect types


Wave Solder Machine Operation/Maintenance
Duration: 45 minutes

Guide to wave soldering
Operation of equipment
Maintenance of:  
fluxer	solder pumps
pre-heat	solder wave
conveyor	fingers
Health & safety
Maintenance procedures


Surface Mount Rework & Repair
Duration: 37 minutes   

Removal/replacement of components
Adhesive removal
Solder short removal
Fine pitch repair
Common repair defects
Health & safety


Solderability Testing 
SMT Components
Duration: 26 minutes

Solderability theory
Component storage conditions
Manual and automatic testing
Solderability criteria
Common solderability defects


De-Soldering Conventional Components
Duration: 24 minutes

De-Soldering theory
Equipment operation
Component removal
Component replacement
Maintenance of equipment
Hand soldering


PCB Outgassing Test Kit
Duration: 10 mins + test procedures 	

Introduction to blow holes/pin holes
Reliability of solder voids
Non-destructive test method
Practical testing procedure
Accept and reject test examples


Reflow Soldering & 
Temperature Profiling
Duration: 30 minutes   

Surface mount assembly
Reflow soldering theory
Vapour phase
Infra-red soldering
Convection reflow
Hands-on temp. profiling methods
Common reflow soldering defects

Introduction to Conventional Assembly
Duration: 40 minutes   

Design Rules
Components
Printed Boards
Component Pre Forming
Manual Assembly
Automatic Assembly
Static Control
Hand Soldering
Wave Soldering
Cleaning
Inspection 
Rework
Soldering Defects


European Inspection 
& Quality Standards
Duration: 30 minutes 

Criteria for:  	
screen printing 
component placement
conventional solder joints
chip components
 J-leads
 gull wing terminations
wire terminations
Common SMT soldering defects


Guide to Basic PCB Manufacture 
Duration: 22 minutes   

Laminates
Drilling operations
Plating
Solder resists
Solder finishes
Panel routing
Microsection examples


Static Control in Electronics
Duration: 30 minutes

Static generation
Component damage
Use of: 	
wrist straps	heel straps
conductive bags	work benches
work coats		trap testers
Static control standards


SMT/Conventional Design for Manufacture
Duration: 55 minutes 

Component selection
Component packaging
Solder resist types and solderable finishes
Hole sizes and pad sizes
Component positioning
Break out points
Fiducial marks and tooling
Laminate materials
Stencil requirements


Introduction to Contamination Testing
Duration: 40 minutes 

Modern assembly techniques
International specifications
Printed circuit board failures
Ionic contamination measurement
Surface insulation resistance measurement


Introduction to X-Ray Inspection
of BGA and Fine Pitch Joints
Duration: 35 minutes 

Criteria for:  	
component placement
BGA joints
chip components
 J-leads
 gull wing terminations
Common SMT soldering defects
Test sheets for operator assessment


Introduction to Surface Mount Technology
Duration: 45 minutes

Component types
Component packaging
Design rules
Solder paste printing
Adhesive application
Reflow/wave soldering
Inspection
Rework and repair
Cleaning
Soldering defects



QUALITY CONTROL & TRAINING WALL CHARTS


Basic Printed Circuit Board Manufacture - a basic step by step guide to the
manufacture of double sided/multi-layer printed circuit boards

Wave Soldering Defect Guide includes common wave soldering defects and their
possible causes including blowholes, shorts, skips and balling

Conventional Soldering Standards includes accept/reject criteria for lead
length, lead clench angle, single sided and double sided solder joints

Printed Circuit Board Manufacturing Defects - examples of defects including
resist lift, outgassing, delamination, solder balling and  possible causes

Surface Mount Soldering Standards - criteria for solder paste, adhesive,
component placement and solder joint standards for all terminations

Conventional Wire Termination Standards includes accept/reject criteria for wire
preparation, termination and solder joint assessment

Surface Mount Assembly Defect Guide illustrates process defects at screen print,
adhesive dispense, placement, soldering and cleaning stages

Surface Mount Component Recognition - photographs of the most common surface
mount component types and their packaging 

PCB Microsection Reference Charts - photo micrographs of satisfactory through
hole and circuit plating and many common manufacturing faults

Ball Grid Array Soldering Guide - X-Ray inspection guide of satisfactory BGA
solder joints and process defects

You should also be able to contact the SMTA office in the US for tape
information. Joanne Stromberg (612) 920 7682 
Contact Electrovert in the US for test board enquires Lisa Oliver (214) 606
1900.

Please send your order together with your sterling cheque from a UK bank for L45
pounds sterling + VAT if in Europe to EPS.

If you require information on EPS' other training services please contact 

Bob Willis
Electroinc Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://