This is the second pass at anyone wanting or interested in attending this
seminar.  Please let us know by the end of this week of any interest as
decisions need to be made regarding the overall program

I appreciate your patience in this matter.

Thanks

Leo Lambert>

Date: Sun, 27 Oct 1996 20:08:54
>To: [log in to unmask]
>From: "Leo P. Lambert" <[log in to unmask]>
>Subject: Seminar, Total Electronics Manufacturing Process Seminar
>
>EPTAC Corp. Presents 
>                
>                "The Total Electronics Manufacturing Process Seminar"
>
>Who Should Attend:
>This Seminar is intended for all Engineering and Manufacturing personnel
working in an electronic manufacturing /assembly environment and those who
supply product designs to the manufacturing environment.
>
>Program Objectives:
>To provide solid, practical information regarding critical and crucial
process elements.
>To present methods of selecting proper materials and identify the pitfalls
encountered when introducing those materials into a manufacturing process.
>To provide technical information that will help in the selection of certain
solder alloys.
>
>Moderators:
>
>Leo Lambert of EPTAC Corp.
>Les Hymes of Les Hymes Associates
>Bill Hampshire, of Hampshire Technical Services
>
>DATE:  November 13-14, 1996
>Place: Double tree Guest Suites, Waltham MA.
>
>FOR INFORMATION:
>			Call EPTAC Corp., 1 800 64-EPTAC
>Program Schedule: DAY ONE
>The Assembly Process,  Process Elements which Cannot be taken for Granted.
>PTH Process Technology
>SMT Process Technology
>Mixed Technology
>
>Integration of Low Residue Soldering Processes
>Introduction and Overview
>Material and Process Qualification
>Quality and Cost Results
>Additional Considerations
>Case Studies
>Lessons Learned
>Best Practices
>
>Metallurgy of Solders
>The Best Guide to Solder Behavior
>The Phase Diagram and What you Need to Know About It.
>How a Solder Joint Ages
>How To improve Solder Properties
>Lead-Free Compositions and the Challenges in Using Them
>Solder-Substrate Interactions
>Wetting and Intermetallic Formation 
>Oxidation
>Solderability and Its Testing
>
>DAY TWO:
>
>Through Hole Connections Made During the Surface Mount Process
>
>Cleanliness Assessment Practices for Cleaned and "No Clean" PWAs
>
>Strength and Fatigue Resistance of Solder Joints.
>
>Roundtable Discussion, Assembly/Design/Materials/Process Ideas and Questions.
>
>

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