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1996

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Wed, 23 Oct 1996 15:35:03 -0400
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                              California Circuits Association

                                          Seminar on

                           Surface Finishes and Solderability

Northern California                                         Southern
California
Thursday, November 7, 1996                            Friday, November 8,
1996
Hyatt San Jose                                                  Holiday Inn
Gateway Plaza
1740 North First Street                                       14299 Firestone
Blvd
San Jose, CA                                                     La Mirada,
CA

                                                A G E N D A

8:00 am      Registration and Continental Breakfast

8:30 am      Introduction

8:45 am      OSP Technology Improvements
                  Roger Mouton, Electrochemicals, Inc.

9:15 am      Nickel-Gold (Electroless/Electrolytic)
                  Ron Barauskas, Lea-Ronal

9:45 am      Electrodeposited Palladium
                  Bruce Stacy, Lucent Technologies

10:15 am     Break

10:30 am    Metallic Silver as an Alternative
                  Steve Beigle, Alpha Metals

11:00 am    Surface Finishes:  The Assembler's Perspective
                  Srinvinas Rao, Solectron Corp.

11:30 am     Solderability Testing with SERA
                  Peter Bratin, ECI Technology

Noon           Analytical Control of Final Finishing Solutions
                   Michael Carano, Electrochemicals, Inc.

12:30 pm      Adjourn

Registration Information

The fee for  the workshop is $125 for CCA and IPC members and $175 for
nonmembers.  Call, fax or email John Riley at IPC to register or with
questions.  Phone 847-509-9700 X308     Fax 847-590-9798     Email
[log in to unmask]

Registration fees include continental breakfast, refreshments, workshop
attendance and proceedings!

You are not alone!  Fine pitch and high lead count devices have moved the
industry toward finer lines and smaller holes.  Both fabricators and
assemblers require new finishing alternatives and new deposition processes.

The solderability stakes are extremely high:  the multilayer printed wiring
board must now provide electronic and mechanical connections for a growing
number of more complicated, more expensive components.  Final finishes are
critical to the successful interconnection between board and package.
 Mistakes at this point can exact a very high price.

How does one choose the right finish?  Which metals work with which component
types?  Where do OSPs fit in?  What are the considerations of the
manufacturer and assembler?  What control procedures keep processes in
optimum condition?  This CCA education conference will give you a good
overview of the options currently available and the progress being made in
this extremely important area of PWB technology.

Who should attend?

This workshop is for anyone involved in PWB manufacturing, especially process
engineers and quality control engineers.  Assemblers, OEMs and anyone who
specifies or inspects PWBs will also gain a lot of valuable information from
the program.

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