I do not know the reason behind modification of that particular
requirement. However, in my experience, the solder in upper bend
radius usually wicks up from the pad during reflow thereby causing
an insufficient solder condition. This is more critical
than solder in lead bend, which is more a process condition 
than a defect. Of course, the question about reliability data 
to verify this remains unanswered.

-- 
Vijay Sankaran          (518) 276-2721          [log in to unmask]
Research Associate
Center for Integrated Electronics and Electronics Manufacturing
Renssleaer Polytechnic Institute
Troy, NY 12180

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