Subject: | |
From: | |
Date: | Wed, 22 May 96 14:08:30 CST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Jack:
In addition to the galvanic effect, you have to worry about fretting corrosion.
The tin that is exposed to the air will oxidize and produce tin oxide. The
micro-vibrations found in any office environment are suffient to allow growth of
this oxide surface between the gold and the tin-lead surface. Eventually this
corrosion will to an intermittent or an open situation. It is extremely
difficuilt to detect this problem since removing the device wipes it clean of
the oxide and reinsertion shows no problem. Bell Laboratories did some
extensive studies in the early 1980s and this was then carried over as a
requirement to the Bellcore Physical Design Requirements.
Harry
\\'''''//
(o o)
@----oOO---------(_)----------------@
| Harry O'Halloran |
| DSC Communications Corporation |
| 1000 Coit Road |
| Plano, TX 75075-5813 |
| Phone: (214) 519-3916 |
| [log in to unmask] |
@--------------------------oOO------@
| __ | __ |
| | | |
ooO Ooo
______________________________ Reply Separator _________________________________
Subject: Re: assy:compatability gold vs tin/lead
Author: [log in to unmask] at SMTPLINK
Date: 5/22/96 1:13 PM
Good morning Jack!
I have several articles in my references that describe both
acceptable use and disastrous use of tin/lead pins in gold sockets. I
think the key word you used is "potential". In the right environment
(moisture - not necessarily water) you will have problems because of
the galvanic effect of tin on gold. If things stay dry then you may
have no problems. For a battery to form you need two dissimilar metals
and an electrolyte - take away one of the three and you avoid
problems. Look at your environment and see if moisture would be a
concern. Also look at the ASM Metals Handbook Vol. 13 Corrosion for
additional information.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: assy:compatability gold vs tin/lead
Author: [log in to unmask] at ccmgw1
Date: 5/22/96 11:11 AM
We have instances where tin/lead coated pins are inserted into gold plated
sockets, etc. Components even have gold/tin-lead or gold/tin interfaces,
such as an IC socket with a gold contact with a tin sleeve. Mil-Std-889B
indicates gold as being incompatable with tin or tin/lead. Has anyone
looked into this issue and is there a potential for corrosion formation and
associated problems? Again, I just refereing to mechanical contact ( not
soldering ).
Thanks,
Jack Tippit
Wilcox Electric
[log in to unmask]
|
|
|