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| Date: | 22 Jun 96 08:19:24 EDT |
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It is common to see the resist expand during reflow soldering and then pop like
a balloon I would not see it as a big deal unless the mask is solid and prevents
the stencil contacting the surface of the pads for second stage printing of
paste in double sided reflow.
Bob Willis
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/bwillis
Email: [log in to unmask]
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