SEM/EDX analysis of a voided area on an electroless Cu deposit on Mitsubishi
BT laminate shows Si, O, Br and Ca ions.  Si and O coming from glass, Br
from epoxy as a flame retardant; where is Ca ion coming from (DI water used
everywhere)?  Has anyone else experienced uneven Cu deposit on this type of
laminate(the larger the hole or cavity the higher occurence of voiding)???
C-stage of this laminate is deliberately undercured; can this have any
impact on the voiding problem?
Thanks for help,
Paul

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