From:  Stephen Ayotte
\\\\\\\EM Quality Engineering
\\\\\\\Bldg. 14-3 Col F5 5-1537
Subject: PC Fab
We are trying to find out what the industry standards or
techniques are for testing solder mask adhesion to immersion
gold.  We have tried a variety of solder mask systems and
have checked the cure using DSC.

Please respond with any specification, military, IPC, ANSI
or otherwise.  Or if anyone has some test they are using that
is not listed in another specification that would be appreciated
too.

We are seeing minor adhesion loss of the solder mask to the
metallurgy and are also wondering if some amount is acceptable?

**** IBM MD Product Quality Engineer****
****         OEM Quality Engineer   ****

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