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| Date: | Tue, 25 Jun 1996 23:37:41 +0800 |
| Content-Type: | text/plain |
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Dear John,
For further understanding, if the board is warpped after reflow or wave-solder,
whether it is caused by the lamination recipe not properly prepared and cleaning
methods are not followed, or due to the board design issue.
Please enlighten me. Thanks you.
Poh Kong Hui
Nera Electronics
Email: [log in to unmask]
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