Good morning:
          Rockwell recently qualified 348 and 3609 for a variety of 
     chipbonding applications. Whether the cognizent engineers can share 
     much in the way of specifics is not known to me, but I've forwarded 
     your message.
          The outgassing data on those products is available from Loctite 
     tech service (either the Electronics group in Detroit, or from the 
     factory where those products originate in Ireland). 
                                                  Marc Carter
                                                  Application Engineer
                                                  Rockwell CACD


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Subject: Chip bonding info
Author:  [log in to unmask] at ccmgw1
Date:    3/27/96 8:52 AM


Does anybody have information and or studies done on bonding glass bodied chip 
with chip bonding material such a loctite 3609 for wave soldering. Also looking 
for out-gasing data on any material that could be used for space applications. 
     
Hector Valladares 
Honeywell Space systems 
Principle SMT Engineer
813-539-3683 voice
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