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1996

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Subject:
RE: Exposing thru-hole componets to reflow temperature cycles.
From:
Bob Willis <[log in to unmask]>
Date:
26 Jul 96 02:49:31 EDT
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You can find some of my FAQ's on through hole reflow in the Technet achieve.

It is poor DFM practice to design a board so that an assembly company does not
have the clearance around surface mount parts for cut and clench. Second stage
manual assembly often requires access as well for lead cropping.

Bob Willis
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/bwillis
Email: [log in to unmask]


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