I am trying to "optimize" a screen printing operation.  This 
     operation screens solder-paste for both SMD and 
     Through-Hole(Paste-In-Hole).  I am using a solder-paste that is 
     90% solids(Non-No-Clean) with a viscosity of 1M(cps)+-100K(cps).
     
     Whew!...Finally my question(s):
     
     I have found that a higher viscosity helps when doing fine-pitch 
     but I may be hurting myself when doing Paste-In-Hole. Is there a 
     relationship (weak or strong) between solids-content and 
     viscosity or do I keep the solids-content a constant and simply 
     ask for a lower viscosity solder-paste if I need it for (PIH)?
     
     
     Thanks
     
     Harlan
     [log in to unmask]