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1996

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Subject:
From:
Larry Waksman <[log in to unmask]>
Date:
Tue, 26 Nov 1996 09:45:38 -0800
Content-Type:
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JIM ENNIS wrote:
> 
> Question:  I need a thermally conductive adhesive to put under a QFP.  I
> know that if I put it on prior to placement, it would screw up my alignment,
> soldering, etc, I plan to add a hole (.100 to .125 dia) in the PCB under the
> center of the part and apply the stuff after all assy is complete.
> 
> The adhesive properties are not important, in fact less is better. The stuff
> should be viscous enough to fill the area under the part, but not run.  It
> should be able to room temp cure in a reasonable time (2 hours or less) and
> not bloom out onto the plastic body of the part.
> 
> Does anyone out there know of such a thing?
> 
> Thanks, in advance
> 
> Jim Ennis
> [log in to unmask]
> 
> ***************************************************************************
Jim,

Check my reply post sent earlier today to the Technet regarding another
thermally conductive application.  Loctite's Output line of activator
cured adhesives should do the trick.  Call them at 1-800-LOCTITE.

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