A subcontractor of ours has asked for solder thieves to be added to SOICs 
that are placed on the solderside of our products.  Others have maintained 
that, if the process is in control, these are not needed.
     Can someone offer data (no opinions, please) that show that these extra 
pad extensions are worth the extra real estate and pain to design 
(orientation, etc)?  Does this really offer a wider process window or is it 
a crutch for poor processes?

Thanx in advance.

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