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Subject:
From:
[log in to unmask] (Mike Avery)
Date:
Fri, 18 Oct 1996 07:41:45 -0500
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multipart/mixed
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     We strongly agree with Mason regarding the need for a uniform design 
     standard. We need to move forward with this technology right now, but 
     have decided to wait untill we can find at least 3 suppliers with the 
     same design rules before incorperating it into any critical designs ( 
     and of course all our designs are critical ).
     
     Mike


______________________________ Reply Separator _________________________________
Subject: Re[2]: Plugged Vias (and laser vias and plasma vias)
Author:  "mhu" <[log in to unmask]> at Internet
Date:    10/17/96 10:57 PM


     
     I appreciate the comments from Glenn Heath (Merix), I think it definitely 
     worth more than just 2 pennies. :)
     
     The experience that Glenn shared proved what I'd mentioned in my message: 
     different manufacturers, having different setup, equipment, may come to 
     different conclusions about the economics of processes.  However, the 
     important conclusion from our discussion is: "We both agree that microvia 
     (blind via) can be a cost saving solution to achieve higher density."
     
     If I'm not mistaken, I believe the design rules for the microvia are pretty
     
     much the same for either plasma or laser drilling (.005"-.006" diameter, 
     .012"-.016" pad).  I think it would be nice if we can all agree upon a set 
     of design rules such that the boards can be made by either technologies.  
     That way we can get rid of the 2nd source suppliers issue, which is a big 
     concern from the designers especially on new technologies.  Any speculation
     
     about which technology is going to take over the market is meaningless 
     unless there is a market.
     
     Mason Hu
     Zycon Corporation
     
     
______________________________ Reply Separator _________________________________
Subject: RE: Plugged Vias (and laser vias and plasma vias)
Author:  [log in to unmask] at corp
Date:    10/17/96 8:11 PM
     
     
Both Mason Hu and John Gulley make valid points about via in pad 
techniques, but I thought I should throw in Merix's 2 cents on the 
matter as well.
     
Mason is right in his statement that laser vias are not always 
slower and more expensive than other methods.  He is definitely 
right in his statement that the use of microvias can make the 
part less expensive than conventional (drill vias) boards through
layer reduction.  I would add that microvias often make boards less 
expensive through size reduction through the increased density which 
is made possible by putting vias in pads.
     
A critical cost factor in comparing the various microvia methods is 
the number of vias in pads.  If the number is low, laser may be the 
most economical and fastest method (unless it is not done in-house; 
then shipping takes time).  Because processes such as DYCOstrate (TM) 
[plasma defined vias -- the process that John mentioned that Merix is 
using] are batch processes, boards with a significant number of 
microvias are less expensive than laser defined via boards.  Merix 
defines it as "buy one via, get the rest free".  Because plasma etchers 
are more common at board fabricators than lasers, the plasma defined via 
process has a greater chance of being performed in-house and is therefore 
often quicker regardless of the number of holes. 
     
Mason's statement about Japan using SLC (IBM-Japan's process) and laser 
is valid, but not surprising considering the plasma defined via process 
was developed in Switzerland.  In Europe, the plasma defined via process
is more popular.  This is similar to the trends of immersion gold acceptance 
in Europe versus OSP acceptance in Japan.  I would say that comparing 
the pricing of laser via boards to plasma via boards has not been very 
thoroughly investigated.  Mason may have been comparing Zycon's pricing to 
HP-Germany's pricing and if that is the case  you would have to factor in 
duty, shipping, and exchange rates as well as board fabrication cost.  For 
the designs that Merix has seen, the DYCOstrate (TM) process has been the most 
economical method of producing microvias.
     
As a whole, microvia technology has advanced very rapidly over the last
few years and is worth investigating by anyone who is interested in reducing 
size, weight, and cost.  Its use should not be limited to the issue of 
plugged vias.
     
     
     
Glenn Heath
Merix Corporation
503-359-2652
[log in to unmask] 
     
     
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