Two thoughts came to my mind concerning the complexity of PCB layout and 
the temperature relationships.

1) When circuit designers design the PCB layout, do they ever consider the 
thermal mass issues and try to layout the components in such a way that 
a more even temperature gradient would result across the PCB during reflow? 
e.g., trying to put larger components around the edge and smaller ones at 
the center region.

2) Does process engineer utilize the Taguchi method to find out the best 
oven temperature settings at different zones, in order to maintain an uniform 
temperature gradient across the PCB?  Or does the forced air furnace 
already taking care of this temperature problem?

Thank you very much in advance.

Vic

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