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| Date: | 27 Mar 1996 09:02:00 U |
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Does anybody have information and or studies done on bonding glass bodied chip
with chip bonding material such a loctite 3609 for wave soldering. Also looking
for out-gasing data on any material that could be used for space applications.
Hector Valladares
Honeywell Space systems
Principle SMT Engineer
813-539-3683 voice
[log in to unmask]
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